Cheng-Ying Ho

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Cheng-Ying Ho, Jenq‐Gong Duh, Chih‐Wei Lin et al. · Journal of Materials Science · 2012 · 54 citations

Materials Science, Materials Engineering, Engineering +9

Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

Cheng-Ying Ho, Jenq‐Gong Duh · Materials Letters · 2012 · 29 citations

Materials Science, Chemical Engineering, Engineering +9

Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength

Cheng-Ying Ho, Jenq‐Gong Duh · Materials Science and Engineering A · 2014 · 25 citations

Materials Engineering, Materials Science, Engineering +10

Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

Cheng-Ying Ho, Jenq‐Gong Duh · Materials Chemistry and Physics · 2014 · 21 citations

Materials Science, Materials Engineering, Engineering +6

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

Wenlin Chen, Chi-Yang Yu, Cheng-Ying Ho et al. · Materials Science and Engineering A · 2014 · 20 citations

Materials Engineering, Materials Science, Engineering +7