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Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength

Materials EngineeringMaterials ScienceEngineeringElectrical ImpedanceMechanical EngineeringApplied PhysicsMetallurgical InteractionCladding (Metalworking)Metal FormingOptimal NiThickness DesignMicrostructureMetal Processing