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Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringApplied PhysicsHigh-speed Impact ResponsesUltra-thin Ni–p DepositMaterial PerformanceMicrostructural VariationElectronic PackagingMicrostructureMetal Processing