Chih‐Wei Lin

Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

Wei Wu, Chih‐Wei Lin, Shubin Huang et al. · Journal of Electronic Materials · 2010 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +16

Fluoride recovery from spent fluoride etching solution through crystallization of Na3AlF6 (synthetic cryolite)

Jie-Yuan Chen, Chih‐Wei Lin, Po‐Han Lin et al. · Separation and Purification Technology · 2014 · 55 citations

Natural Sciences, Materials Engineering, Materials Science +10

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Cheng-Ying Ho, Jenq‐Gong Duh, Chih‐Wei Lin et al. · Journal of Materials Science · 2012 · 54 citations

Natural Sciences, Materials Engineering, Materials Science +14

Characterization of aerosol emissions from single bubble bursting

Wei-Ren Ke, Yu-Mei Kuo, Chih‐Wei Lin et al. · Journal of Aerosol Science · 2017 · 38 citations

Natural Sciences, Earth Sciences, Air Pollution +12

An Experimental Study on Performance Improvement of the Stairmand Cyclone Design

Chia-Wei Hsu, Sheng-Hsiu Huang, Chih‐Wei Lin et al. · Aerosol and Air Quality Research · 2014 · 27 citations · Full text

Engineering, Aerospace Engineering, Aerodynamics +16