Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints - Concepedia

Concepedia

Publication | Closed Access

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

20

Citations

33

References

2014

Year

Wenlin Chen, Chi-Yang Yu, Cheng-Ying Ho, Jenq‐Gong Duh

Materials Science and Engineering A

Materials EngineeringMaterials ScienceEngineeringImpact ReliabilityApplied PhysicsAlloy DesignTin CrystallographyThermal AnnealingMicrostructureMetal Processing

References

	Year	Citations

Page 1