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Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

Materials ScienceMaterials EngineeringEngineeringMicrostructureApplied PhysicsCu–sn Intermetallic CompoundsMetallurgical ProcessUltrathin-enepig MetallizationMetal Processing