Concepedia

Wen Sheng Lee

WS

Statistics

Publications

4

Citations

234

H-Index

4

Active since

2010

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Wen Sheng Lee is an author at Institute of Microelectronics specializing in chip packaging, engineering, and semiconductor devices.

Publications per year

2010–2014

4

Publications

4

Vapor phase hydrodeoxygenation of furfural to 2-methylfuran on molybdenum carbide catalysts

Wen Sheng Lee, Zhenshu Wang, Weiqing Zheng et al. · Catalysis Science & Technology · 2014 · 145 citations

Natural Sciences, Chemical Engineering, Chemistry +17

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications

Soon Wee Ho, Fernardez Moses Daniel, Li Yan Siow et al. · 2010 · 14 citations

Engineering, Materials Engineering, Materials Science +17

Evaluation of support wafer system for thin wafer handling

Wai Hong See Toh Justin, Tai Chong Chai, Vempati Srinivasa Rao et al. · 2010 · 10 citations

Engineering, Materials Engineering, Materials Science +16

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