C. C. Goldsmith

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

Materials Engineering, Materials Science, Engineering +6

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

Materials Science, Materials Engineering, Engineering +6

Interfacial reaction studies on lead (Pb)-free solder alloys

S. K. Kang, Da‐Yuan Shih, Keith Fogel et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 81 citations

Materials Engineering, Materials Science, Engineering +15

Measurement of stresses generated in cured polyimide films

C. C. Goldsmith, P. Geldermans, F. Bedetti et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1983 · 54 citations

Materials Science, Engineering, Glass Transition +13