Yu-Wei Huang

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 45 citations · Full text

Top Chip, Through-silicon Hole Interposers, Electrical Engineering +15

The influences of Al species and Ti species on the catalytic epoxidation over Si/Ti-pillared MCM-36 synthesized from MCM-22

Fang Jin, Shing‐Jong Huang, Soofin Cheng et al. · Catalysis Science & Technology · 2015 · 29 citations

Materials Science, Inorganic Chemistry, Chemical Engineering +12

Fiber-based swept-source terahertz radar

Yu-Wei Huang, Tzu-Fang Tseng, Chung-Chiu Kuo et al. · Optics Letters · 2010 · 20 citations

Radar, Terahertz Devices, Terahertz Spectroscopy +9

Process, assembly and electromigration characteristics of glass interposer for 3D integration

Chun-Hsien Chien, Ching-Kuan Lee, Chun‐Te Lin et al. · 2014 · 18 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

Development and reliability of ultra-thin chip on plastic bonding for flexible liquid crystal displays

Yu-Wei Huang, Su‐Tsai Lu · 2010 · 14 citations