M. Hiroi

SiC film formation on Si(001) by reaction with C2H2 beams

I. Kusunoki, M. Hiroi, Takahiro Sato et al. · Applied Surface Science · 1990 · 47 citations

Engineering, Materials Engineering, Materials Science +14

Effects of Ti Addition on Via Reliability in Cu Dual Damascene Interconnects

M. Ueki, M. Hiroi, Nobuyuki Ikarashi et al. · IEEE Transactions on Electron Devices · 2004 · 24 citations

Engineering, Electrical Engineering, Materials Engineering +17

Suppression of bimodal stress-induced voiding using high-diffusive dopant from Cu-alloy seed layer

Takashi Tonegawa, M. Hiroi, K. Motoyama et al. · 2004 · 14 citations

Engineering, Materials Engineering, Materials Science +17

Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

M. Ueki, M. Narihiro, H. Ohtake et al. · 2004 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +12

A novel selective SiGe epitaxial growth technology for self-aligned HBTs

Fumihiko Satô, Takashi Hashimoto, T. Tashiro et al. · 2003 · 10 citations

Engineering, Electrical Engineering, Materials Science +16