Low-power embedded ReRAM technology for IoT applications

M. Ueki, Kazuhiro Takeuchi, Takashi Yamamoto, +15

Automated Headspace Solid-Phase Microextraction and In-Matrix Derivatization for the Determination of Amphetamine-Related Drugs in Human Urine by Gas Chromatography-Mass Spectrometry

A. Namera, Mikio Yashiki, Takashi Kojima, +1

Journal of Chromatographic Science

Sub-50-nm physical gate length CMOS technology and beyond using steep halo

Hitoshi Wakabayashi, M. Ueki, M. Narihiro, +8

IEEE Transactions on Electron Devices

Low-power ElectronicsElectrical EngineeringPhysical Design (Electronics)EngineeringVlsi Design +12

45-nm gate length CMOS technology and beyond using steep halo

Hitoshi Wakabayashi, M. Ueki, M. Narihiro, +8

Low-power ElectronicsElectrical EngineeringEngineeringVlsi DesignNanoelectronics +10

Low-power embedded ReRAM technology for IoT applications

M. Ueki, K. T. Akeuchi, Toru Yamamoto, +15

Comprehensive Chemistry Designs in Porous SiOCH Film Stacks and Plasma Etching Gases for Damageless Cu Interconnects in Advanced ULSI Devices

Y. Hayashi, H. Ohtake, J. Kawahara, +10

IEEE Transactions on Semiconductor Manufacturing

Comprehensive Chemistry DesignsEngineeringNanoporous MaterialChemistryChemical Deposition +18

Effects of Ti Addition on Via Reliability in Cu Dual Damascene Interconnects

M. Ueki, M. Hiroi, Nobuyuki Ikarashi, +4

IEEE Transactions on Electron Devices

EngineeringChemical DepositionTi AdditionInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors) +15

Tracking growth hormone abuse in sport: A comparison of distinct isoform-based assays

Jaume Bosch, M. Ueki, Gerard Such-Sanmartín, +2

Analytica Chimica Acta

Physical ActivityKinesiologyBody CompositionDistinct Isoform-based AssaysGrowth Hormone +4

Robust Cu Dual Damascene Interconnects With Porous SiOCH Films Fabricated by Low-Damage Multi-Hard-Mask Etching Technology

H. Ohtake, M. Tagami, Munehiro Tada, +5

IEEE Transactions on Semiconductor Manufacturing

EngineeringPlasma ProcessingInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +20

Highly-oriented PVD Ruthenium Liner for Low-resistance Direct-plated Cu Interconnects

Mari Abe, M. Ueki, Munehiro Tada, +5

Materials EngineeringMaterials ScienceElectrical Engineering3D Ic ArchitectureEngineering +12