Toshiro Doi

Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials

Hideo Aida, Toshiro Doi, Hidetoshi Takeda et al. · Current Applied Physics · 2012 · 257 citations

Engineering, Materials Engineering, Materials Science +14

Chemical Mechanical Polishing of Gallium Nitride with Colloidal Silica

Hideo Aida, Hidetoshi Takeda, Koji Koyama et al. · Journal of The Electrochemical Society · 2011 · 92 citations

Engineering, Materials Engineering, Materials Science +17

Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives

Hideo Aida, Hidetoshi Takeda, Seong‐Woo Kim et al. · Applied Surface Science · 2013 · 90 citations

Dentistry, Materials Engineering, Materials Science +10

The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)

Chengwu Wang, Syuhei KUROKAWA, Toshiro Doi et al. · ECS Journal of Solid State Science and Technology · 2017 · 59 citations

Engineering, Materials Engineering, Materials Science +17

Effect of Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMP

D. Rosales-Yeomans, Toshiro Doi, M. Kinoshita et al. · Journal of The Electrochemical Society · 2004 · 47 citations

Engineering, Materials Engineering, Materials Science +17