Syuhei KUROKAWA

The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)

Chengwu Wang, Syuhei KUROKAWA, Toshiro Doi et al. · ECS Journal of Solid State Science and Technology · 2017 · 57 citations

Laser Processing (Laser Material Processing), Engineering, Mechanical Engineering +18

Kupffer Cells May Autoregulate Interleukin 1 Production by Producing Interleukin 1 Inhibitor and Prostaglandin E₂

M Shirahama, Hiromi Ishibashi, Yuki Tsuchiya et al. · Scandinavian Journal of Immunology · 1988 · 38 citations

Derivation of parameters of global form deviations for 3-dimensional surfaces in actual manufacturing processes

Tilo Pfeifer, Syuhei KUROKAWA, Stefan Meyer · Measurement · 2001 · 36 citations

Geometric Modeling, Actual Manufacturing Processes, Engineering +13

Preparation and characterization of composite coatings containing a quaternary ammonium salt as an anti-static agent

Yuki Kugimoto, Atsumi Wakabayashi, Toshiaki Dobashi et al. · Progress in Organic Coatings · 2016 · 36 citations

Materials Science, Quaternary Ammonium Salt, Chemical Engineering +10

Polishing Characteristics of MnO2 Polishing Slurry on the Si-face of SiC Wafer

Tao Yin, Tosiro Doi, Syuhei KUROKAWA et al. · International Journal of Precision Engineering and Manufacturing · 2018 · 35 citations

Materials Science, Materials Engineering, Chemical Engineering +8