D. Rosales-Yeomans - Concepedia

Author

D. Rosales-Yeomans

University of Arizona

Also Known As

D. Rosales-Yeomans, Daniel Rosales-Yeomans

Publications

223

Citations

H-Index

Concepts

All Affiliations

University of Arizona Intel (United States)Saitama University

About

D. Rosales-Yeomans is an author at University of Arizona specializing in engineering, mechanical engineering, and microfabrication.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	192
2	Chemical Engineering	2	2	46
3	Applied Physics	1	1	14
4	Chemistry	1	1	41
5	Industrial Engineering	1	1	13

D. Rosales-Yeomans

Publications

202

Citations

H-Index

Page 1

	Year	Citations
Effect of Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMP D. Rosales-Yeomans, Toshiro Doi, M. Kinoshita, Journal of The Electrochemical Society Materials ScienceTribological CoatingEngineeringMicrofabricationLubrication Mechanism	2004	46
Characterization of copper-hydrogen peroxide film growth kinetics Darren DeNardis, D. Rosales-Yeomans, L. Borucki, Thin Solid Films EngineeringCorrosionOxidation ResistanceSurface ScienceChemistry	2006	41
Design and Evaluation of Pad Grooves for Copper CMP D. Rosales-Yeomans, Darren DeNardis, L. Borucki, Journal of The Electrochemical Society EngineeringMechanical EngineeringMineral ProcessingChemical EngineeringMaterial Processing	2008	30
Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization D. Rosales-Yeomans, H. Lee, T. Suzuki, Thin Solid Films Pad Groove PatternsEngineeringMicrofabricationMechanicsMechanical Engineering	2011	22
Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models Darren DeNardis, D. Rosales-Yeomans, L. Borucki, Thin Solid Films Process DesignChemical EngineeringEngineeringCorrosionOxidation Resistance	2009	16
Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process D. Rosales-Yeomans, L. Borucki, Toshiro Doi, Journal of The Electrochemical Society EngineeringMechanical EngineeringNanotribologyInterconnect (Integrated Circuits)Wafer Scale Processing	2006	14
Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP D. Rosales-Yeomans, Darren DeNardis, L. Borucki, Journal of The Electrochemical Society Materials ScienceCopper CmpEngineeringIndustrial EngineeringCopper Polishing	2008	13
Analysis of Pads with Slanted Grooves for Copper CMP D. Rosales-Yeomans, Darren DeNardis, L. Borucki, Journal of The Electrochemical Society Materials ScienceCopper CmpEngineeringMaterial ProcessingMicrofabrication	2008	10
A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry Darren DeNardis, D. Rosales-Yeomans, L. Borucki, Thin Solid Films	2009	10

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