C.H. Yang

Electromigration in thin-film solder joints

Cheng–En Ho, C.H. Yang, L.H. Hsu · Surface and Coatings Technology · 2014 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +6

Aging effect on a Ti47.25Ni48.75V4 shape memory alloy

Hsin-Chih Lin, C.H. Yang, Meng‐Chang Lin et al. · Journal of Alloys and Compounds · 2007 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +9

In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage

C.H. Yang, Shu-Ying Yang, Bau-Chin Huang et al. · Surface and Coatings Technology · 2019 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +14

Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer

C.Y. Lee, Shu-Ying Yang, C.H. Yang et al. · Surface and Coatings Technology · 2020 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +9

Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Cheng–En Ho, L.H. Hsu, C.H. Yang et al. · Thin Solid Films · 2014 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +15