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In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage

Materials ScienceIn-situ CharacterizationElectromigration TechniqueEngineeringSubstrate WarpageSevere Plastic DeformationSurface ElectrochemistrySurface ScienceApplied PhysicsMicrostructure TransitionElectronic PackagingChemical DepositionMicrostructure