C.Y. Lee

IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Cheng–En Ho, Shu-Ying Yang, Pei-Tzu Lee et al. · Journal of Materials Research and Technology · 2021 · 39 citations · Full text

Materials Science, Advanced Packaging, Imc Microstructure +15

In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage

C.H. Yang, Shu-Ying Yang, Bau-Chin Huang et al. · Surface and Coatings Technology · 2019 · 22 citations

Materials Science, In-situ Characterization, Electromigration Technique +10

Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer

C.Y. Lee, Shu-Ying Yang, C.H. Yang et al. · Surface and Coatings Technology · 2020 · 19 citations

Materials Engineering, Materials Science, Engineering +3

Investigating the transport characteristics and cell performance for a micro PEMFC through the micro sensors and CFD simulations

A. Su, Yuh-Ming Ferng, Wenyuan Chen et al. · International Journal of Hydrogen Energy · 2012 · 16 citations

Electrical Engineering, Engineering, Microfabrication +10