Concepedia

Bau-Chin Huang

BH

2

Publications

47

Citations

2

H-Index

2019

Active since

Affiliations

Yuan Ze University(Current)

Bau-Chin Huang is an author at Yuan Ze University specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial Science3D PrintingSurface ScienceMicrofabricationMaterial ProcessingElectronic PackagingMaterials Engineering

Publications per year

2019–2019

2

Publications

2

Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship

Bau-Chin Huang, Cheng‐Hsien Yang, Cheng‐Yu Lee et al. · Microelectronics Reliability · 2019 · 25 citations

Materials Science, Materials Engineering, Pulse-reverse Plating +13

In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage

C.H. Yang, Shu-Ying Yang, Bau-Chin Huang et al. · Surface and Coatings Technology · 2019 · 22 citations

Materials Science, In-situ Characterization, Electromigration Technique +10

Rows per page

1–2 of 2