L.H. Hsu

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

S. J. Wang, L.H. Hsu, N. K. Wang et al. · Journal of Electronic Materials · 2013 · 43 citations

Materials Science, Materials Engineering, Material Analysis +11

Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System

Cheng–En Ho, L.H. Hsu, Shi‐Woei Lin et al. · Journal of Electronic Materials · 2011 · 28 citations

Materials Engineering, Materials Science, Chemical Engineering +11

Electromigration in thin-film solder joints

Cheng–En Ho, C.H. Yang, L.H. Hsu · Surface and Coatings Technology · 2014 · 25 citations

Materials Science, Electrical Engineering, Electromigration Technique +7

Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

Cheng–En Ho, Wei Wu, L.H. Hsu et al. · Journal of Electronic Materials · 2011 · 23 citations

Materials Science, Materials Engineering, Engineering +8

Electron backscatter diffraction characterization of electrolytic Cu deposition in the blind-hole structure: Current density effect

Cheng–En Ho, C.C. Chen, L.H. Hsu et al. · Thin Solid Films · 2015 · 21 citations

Materials Science, Engineering, Electron-beam Lithography +9