C.C. Chen

IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Cheng–En Ho, Shu-Ying Yang, Pei-Tzu Lee et al. · Journal of Materials Research and Technology · 2021 · 42 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Real time traffic information and its impacts on route switching behavior of expressway drivers

Rong‐Chang Jou, Soi‐Hoi Lam, Mei‐Chuan Weng et al. · Journal of Advanced Transportation · 2004 · 35 citations

Planning, Transportation Planning, Transport +11

High-speed Cu electrodeposition and its solderability

Pei-Tzu Lee, Ying-Syuan Wu, Ping-Chou Lin et al. · Surface and Coatings Technology · 2016 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +10

Electron backscatter diffraction characterization of electrolytic Cu deposition in the blind-hole structure: Current density effect

Cheng–En Ho, C.C. Chen, L.H. Hsu et al. · Thin Solid Films · 2015 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +13

TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film

Cheng–En Ho, C.C. Chen, C.H. Yang et al. · Surface and Coatings Technology · 2018 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +10