Ying-Syuan Wu

In-situ study on the self-annealing behavior of electroplated Cu through the cantilever method, XRD, and EBSD

Cheng–En Ho, Chang-Chih Chen, Ming-Kai Lu et al. · Surface and Coatings Technology · 2016 · 48 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Depth-dependent self-annealing behavior of electroplated Cu

Chang-Chih Chen, Cheng‐Hsien Yang, Ying-Syuan Wu et al. · Surface and Coatings Technology · 2016 · 47 citations

Materials Science, Materials Engineering, Electrical Engineering +6

High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

Pei-Tzu Lee, Chih‐Hao Chang, Cheng‐Yu Lee et al. · Materials & Design · 2021 · 31 citations · Full text

Engineering, Electrode-electrolyte Interface, Mechanical Engineering +19

High-speed Cu electrodeposition and its solderability

Pei-Tzu Lee, Ying-Syuan Wu, Ping-Chou Lin et al. · Surface and Coatings Technology · 2016 · 29 citations

Materials Science, Electrical Engineering, Engineering +5

High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage

Pei-Tzu Lee, Ying-Syuan Wu, C. Y. Lee et al. · Journal of The Electrochemical Society · 2018 · 15 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +22