Electromigration in thin-film solder joints

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

Natural Sciences, Chemistry, Materials Science +8

Reliability challenges in 3D IC packaging technology

K. N. Tu · Microelectronics Reliability · 2010 · 636 citations

Engineering, Manufacturing Engineering, Electronic Materials +13

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

Natural Sciences, Materials Engineering, Materials Science +6

Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions

Sinn-wen Chen, Chih‐Ming Chen, Wen-Chyuarn Liu · Journal of Electronic Materials · 1998 · 203 citations

Natural Sciences, Materials Science, Physics +14

Electromigration in stressed thin films

K. N. Tu · Physical review. B, Condensed matter · 1992 · 146 citations

Natural Sciences, Electrical Engineering, Materials Science +15