Chih Hang Tung

Dielectric breakdown mechanisms in gate oxides

S. Lombardo, J. H. Stathis, B.P. Linder et al. · Journal of Applied Physics · 2005 · 427 citations

Electrical Engineering, Engineering, Physics +13

Percolation path and dielectric-breakdown-induced-epitaxy evolution during ultrathin gate dielectric breakdown transient

Chih Hang Tung, K. L. Pey, Lei Tang et al. · Applied Physics Letters · 2003 · 102 citations

Materials Engineering, Electrical Engineering, Semiconductor Device +14

Dielectric-breakdown-induced epitaxy: a universal breakdown defect in ultrathin gate dielectrics

T.A.L. Selvarajoo, Rakesh Ranjan, K. L. Pey et al. · IEEE Transactions on Device and Materials Reliability · 2005 · 25 citations

Electrical Engineering, Semiconductor Device, Engineering +12

Investigation of under bump metallization systems for flip-chip assemblies

Poi Siong Teo, Yu‐Wen Huang, Chih Hang Tung et al. · 2002 · 20 citations

Engineering, Bump Metallization Systems, Mechanical Engineering +17

Structure and Conductance of the Breakdown Spot During the Early Stages of Progressive Breakdown

G. Condorelli, S. Lombardo, Félix Palumbo et al. · IEEE Transactions on Device and Materials Reliability · 2006 · 16 citations

Ap4 V, Electrical Engineering, Semiconductor Device +15