Concepedia

Poi Siong Teo

PS

4

Publications

135

Citations

4

H-Index

2002

Active since

Affiliations

Institute of Microelectronics(Current)

Singapore Science Park

Nanyang Technological University

Poi Siong Teo is an author at Institute of Microelectronics specializing in materials science, engineering, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectronic PackagingMaterials EngineeringCorrosionMicrostructureMicroelectronicsMicrofabricationSurface Science

Publications per year

2002–2005

4

Publications

4

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Aditya Kumar, Zhong Chen, Subodh G. Mhaisalkar et al. · Thin Solid Films · 2005 · 77 citations · Full text

Materials Engineering, Materials Science, Engineering +7

Characterization of nonconductive adhesives for flip-chip interconnection

Lay Kuan Teh, Chee Cheong Wong, Subodh G. Mhaisalkar et al. · Journal of Electronic Materials · 2004 · 28 citations

Materials Science, Engineering, Microfabrication +7

Investigation of under bump metallization systems for flip-chip assemblies

Poi Siong Teo, Yu‐Wen Huang, Chih Hang Tung et al. · 2002 · 20 citations

Engineering, Bump Metallization Systems, Mechanical Engineering +17

Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Chih Hang Tung, Poi Siong Teo, C. Lee · IEEE Transactions on Device and Materials Reliability · 2005 · 10 citations

Engineering, Lead-free Solder, Interface Microstructure Interaction +17

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