Concepedia

C. Lee

CL

3

Publications

85

Citations

3

H-Index

2003

Active since

Affiliations

Infineon Technologies (Singapore)(Current)

C. Lee is an author at Infineon Technologies (Singapore) specializing in electronic packaging, engineering, and materials science.

Top concepts

Publications per year

2003–2006

3

Publications

3

Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

Anders Yeo, C. Lee, J.H.L. Pang · IEEE Transactions on Components and Packaging Technologies · 2006 · 58 citations

, , +20

Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package

D. Pinjala, N. Khan, Ling Xie et al. · 2003 · 17 citations

, , +19

Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Chih Hang Tung, Poi Siong Teo, C. Lee · IEEE Transactions on Device and Materials Reliability · 2005 · 10 citations

, , +17

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