Concepedia

Satoru Ogawa

SO

6

Publications

193

Citations

6

H-Index

2005

Active since

Affiliations

The University of Osaka(Current)

Nichia Corporation (Japan)

Osaka Research Institute of Industrial Science and Technology

Tokushima University

Satoru Ogawa is an author at The University of Osaka specializing in engineering, materials science, and applied physics.

Top concepts

Publications per year

2005–2015

6

Publications

6

Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · Acta Materialia · 2015 · 51 citations

, , +9

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

Masafumi Kuramot, Satoru Ogawa, Miki Niwa et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 49 citations

, , +17

Valence Shift of Pr Ion from 3+ to 4+ in (Pr<sub>1-<i>y</i></sub>Y<sub><i>y</i></sub>)<sub>0.7</sub>Ca<sub>0.3</sub>CoO<sub>3</sub> Estimated by X-Ray Absorption Spectroscopy

Hiroyuki Fujishiro, Tomoyuki Naito, Satoru Ogawa et al. · Journal of the Physical Society of Japan · 2012 · 35 citations

, , +20

Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment

Masafumi Kuramoto, Teppei Kunimune, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 28 citations

, , +18

Low-Temperature Pressure-Less Silver Direct Bonding

Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 17 citations

, , +16

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