Concepedia
Statistics
Publications
4
Citations
132
H-Index
Active since
2011
Affiliations
The University of Osaka(Current)
Nichia Corporation (Japan)
Osaka Research Institute of Industrial Science and Technology
Tokushima University
Masafumi Kuramoto is an author at The University of Osaka specializing in materials science, electronic materials, and materials engineering.
Publications per year
2011–2015
Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature
Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · Acta Materialia · 2015 · 51 citations
Natural Sciences, Materials Engineering, Materials Science +13
New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages
Masafumi Kuramoto, Shingo Ogawa, Miki Niwa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 36 citations
Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment
Masafumi Kuramoto, Teppei Kunimune, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 28 citations
Engineering, Materials Engineering, Materials Science +17
Low-Temperature Pressure-Less Silver Direct Bonding
Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 17 citations
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