Concepedia

Teppei Kunimune

TK

4

Publications

152

Citations

4

H-Index

2012

Active since

Affiliations

The University of Osaka(Current)

Nichia Corporation (Japan)

Osaka Research Institute of Industrial Science and Technology

Teppei Kunimune is an author at The University of Osaka specializing in applied physics, electronic packaging, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingSurface ScienceMicroelectronicsSinteringMicrostructureOptoelectronicsPhotonics

Publications per year

2012–2015

4

Publications

4

Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films

Chulmin Oh, Shijo Nagao, Teppei Kunimune et al. · Applied Physics Letters · 2014 · 56 citations

Engineering, Crystal Growth Technology, Integrated Circuits +22

Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · Acta Materialia · 2015 · 51 citations

Materials Science, Solid-state Lighting, Engineering +9

Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment

Masafumi Kuramoto, Teppei Kunimune, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 28 citations

Engineering, Surface Nanotechnology, Optoelectronic Devices +18

Low-Temperature Pressure-Less Silver Direct Bonding

Teppei Kunimune, Masafumi Kuramoto, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 17 citations

Engineering, Electronic Packaging, Led Die +16

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