Concepedia
Statistics
Publications
4
Citations
124
H-Index
Active since
2005
Affiliations
Tokushima University(Current)
The University of Osaka
Nichia Corporation (Japan)
Osaka Research Institute of Industrial Science and Technology
Miki Niwa is an author at Tokushima University specializing in materials science, materials engineering, and electronic materials.
Publications per year
2005–2012
Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles
Masafumi Kuramot, Satoru Ogawa, Miki Niwa et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 49 citations
Engineering, Materials Engineering, Materials Science +15
New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages
Masafumi Kuramoto, Shingo Ogawa, Miki Niwa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 36 citations
Natural Sciences, Materials Engineering, Materials Science +13
Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment
Masafumi Kuramoto, Teppei Kunimune, Satoru Ogawa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 28 citations
Engineering, Materials Engineering, Materials Science +17
Exceptional chiroptical behavior near ceiling temperature in free radical polymerization of menthyl 2-acetamidoacrylates
Hitoshi Tanaka, Miki Niwa · Polymer · 2005 · 11 citations
Natural Sciences, Chemical Engineering, Chemistry +9
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