K. Kata

Low dielectric constant new materials for multilayer ceramic substrate

K. Kata, Yuzo Shimada, H. Takamizawa · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

Real chip size three-dimensional stacked package

T. Yamazaki, Y. Sogawa, Rieka YOSHINO et al. · IEEE Transactions on Advanced Packaging · 2005 · 14 citations

Engineering, Materials Engineering, Materials Science +16

Fabrication of controlled porosity in a tape cast glass ceramic substrate material

Joyce K. Yamamoto, K. Kata, Yuzo Shimada · Materials Letters · 1989 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +11

Large scale multilayer glass-ceramic substrate for supercomputer

Yuzo Shimada, Yuichi Kobayashi, K. Kata et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +13

Simple-structure, generally applicable chip-scale package

S. Matsuda, K. Kata, E. Hagimoto · 2002 · 10 citations

Engineering, Electrical Engineering, Materials Engineering +15