Statistics
Publications
1
Citations
14
H-Index
1
Active since
2005
Affiliations
NEC (Japan)(Current)
Rieka YOSHINO is an author at NEC (Japan) specializing in package miniaturization, materials engineering, and semiconductor devices.
Publications per year
2005–2005
1
1
Real chip size three-dimensional stacked package
T. Yamazaki, Y. Sogawa, Rieka YOSHINO et al. · IEEE Transactions on Advanced Packaging · 2005 · 14 citations
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