Statistics
Publications
4
Citations
208
H-Index
4
Active since
1998
Affiliations
NEC (Japan)(Current)
Y. Sogawa is an author at NEC (Japan) specializing in materials science, materials engineering, and thin films.
Publications per year
1998–2005
4
4
Real chip size three-dimensional stacked package
T. Yamazaki, Y. Sogawa, Rieka YOSHINO et al. · IEEE Transactions on Advanced Packaging · 2005 · 14 citations
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