2002 · 10 citations · 0 references
EngineeringElectrical EngineeringMaterials EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesAdhesive BondingChip PackagingIntegrated Circuit DesignIntegrated Circuit FabricationPackage DesignPackaging EngineeringAdvanced PackagingBumpsChip-scale PackagingDevice PackagingShrinkageSimple Structure
One way to provide the ultimate shrinkage, required for the fabricating of small, lightweight, and high-performance electrical devices is by using chip-scale packaging. We have therefore developed an original chip-scale package called fine-pitch BGA (FPBGA), which has a very simple structure, consisting of carrier tape, an adhesive layer, and solder bumps. Its assembly process is similar to that of TCP assembly, and FPBGA has many advantages over other IC mounting processes and other similar chip-scale packages.