Raiyo Aspandiar

iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

Haley Fu, Raiyo Aspandiar, Jimmy Chen et al. · 2018 · 23 citations

Materials Science, Sac Solder Balls, Engineering +13

Impact of processing conditions and solder materials on surface mount assembly defects

R. Sidhu, Raiyo Aspandiar, Steve Vandervoort et al. · JOM · 2011 · 17 citations

Materials Science, Industrial Design, Engineering +9

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Yaohui Fan, Yifan Wu, Travis Dale et al. · Journal of Electronic Materials · 2021 · 16 citations

Materials Science, Materials Engineering, Engineering +11

The interactions of lead (Pb) in lead free solder (Sn/Ag/Cu) system

C. Key Chung, Raiyo Aspandiar, Kum Foo Leong et al. · 2003 · 15 citations

Materials Science, Materials Engineering, Solder Interaction +15

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

Haley Fu, Jagadeesh Radhakrishnan, Morgana Ribas et al. · 2018 · 13 citations

Engineering, Mechanical Engineering, Solder Suppliers +17