Concepedia

Jagadeesh Radhakrishnan

JR

3

Publications

51

Citations

3

H-Index

2002

Active since

Affiliations

Intel (United States)(Current)

Nokia (United States)

Microsoft (United States)

Soochow University

Wistron (Taiwan)

Jagadeesh Radhakrishnan is an author at Intel (United States) specializing in engineering, electronic packaging, and corrosion.

Top concepts

Publications per year

2002–2018

3

Publications

3

iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

Haley Fu, Raiyo Aspandiar, Jimmy Chen et al. · 2018 · 23 citations

, , +13

Development of compact thermal models for advanced electronic packaging: methodology and experimental validation for a single-chip CPGA package

A. Aranyosi, Alfonso Ortega, John L. Evans et al. · 2002 · 15 citations

, , +20

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

Haley Fu, Jagadeesh Radhakrishnan, Morgana Ribas et al. · 2018 · 13 citations

, , +17

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