Concepedia

Morgana Ribas

MR

3

Publications

49

Citations

3

H-Index

2013

Active since

Affiliations

Indium Corporation (United States)(Current)

Nokia (United States)

Microsoft (United States)

Soochow University

Wistron (Taiwan)

Morgana Ribas is an author at Indium Corporation (United States) specializing in electronic packaging, materials science, and microstructure.

Top concepts

Publications per year

2013–2018

3

Publications

3

iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

Haley Fu, Raiyo Aspandiar, Jimmy Chen et al. · 2018 · 23 citations

, , +13

Development of low-temperature drop shock resistant solder alloys for handheld devices

Morgana Ribas, Sujatha Chegudi, Anil Kumar et al. · 2013 · 13 citations

, , +15

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

Haley Fu, Jagadeesh Radhakrishnan, Morgana Ribas et al. · 2018 · 13 citations

, , +17

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