Concepedia

Haley Fu

HF

6

Publications

89

Citations

6

H-Index

2015

Active since

Affiliations

Flex (United States)(Current)

Intel (Malaysia)

Lenovo (China)

Indium Corporation (United States)

Intel (United States)

Haley Fu is an author at Flex (United States) specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

Publications per year

2015–2019

6

Publications

6

iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

Haley Fu, Raiyo Aspandiar, Jimmy Chen et al. · 2018 · 23 citations

, , +13

Recent trends of package warpage and measurement metrologies

Wei Keat Loh, Ron Kulterman, Haley Fu et al. · 2016 · 16 citations

Recent trend of package warpage characteristic

Wei Keat Loh, Ron Kulterman, Tim Purdie et al. · 2015 · 14 citations

, , +19

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

Haley Fu, Jagadeesh Radhakrishnan, Morgana Ribas et al. · 2018 · 13 citations

, , +17

Comparison of advanced package warpage measurement metrologies

Ron W. Kultcrman, Wei Keat Loh, Haley Fu et al. · 2016 · 12 citations

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