3
Publications
41
Citations
3
H-Index
2015
Active since
Affiliations
Ron Kulterman is an author at Flex (United States) specializing in engineering, electronic packaging, and mechanical engineering.
Top concepts
EngineeringElectronic PackagingMechanical Engineering3D PrintingHeat TransferRefrigerationMicrostructureSoftware DesignSolid MechanicsMaterial Science
Publications per year
2015–2019
3
3
Recent trends of package warpage and measurement metrologies
Wei Keat Loh, Ron Kulterman, Haley Fu et al. · 2016 · 16 citations
Recent trend of package warpage characteristic
Wei Keat Loh, Ron Kulterman, Tim Purdie et al. · 2015 · 14 citations
Software Maintenance, Engineering, Industrial Engineering +19
Rows per page
1–3 of 3