R. Sidhu

Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites

Nikhilesh Chawla, R. Sidhu, V.V. Ganesh · Acta Materialia · 2006 · 284 citations

Natural Sciences, Materials Engineering, Materials Science +16

Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

Xin Deng, R. Sidhu, Peter M. Johnson et al. · Metallurgical and Materials Transactions A · 2005 · 173 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

Mariusz Dudek, R. Sidhu, Nikhilesh Chawla et al. · Journal of Electronic Materials · 2006 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +14

Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning

R. Sidhu, Nikhilesh Chawla · Materials Characterization · 2004 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints

R. Sidhu, Xin Deng, Nikhilesh Chawla · Metallurgical and Materials Transactions A · 2007 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +17