Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints - Concepedia

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Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

172

Citations

33

References

2005

Year

Xin Deng, R. Sidhu, Peter M. Johnson, Nikhilesh Chawla

Metallurgical and Materials Transactions A

Materials ScienceFriction WeldingEngineeringDurability PerformanceCorrosionMechanical EngineeringHot WorkingFracture BehaviorShear StrengthSn-3.5ag Solder/cu JointsMechanics Of MaterialsMicrostructureMetal Processing

References

	Year	Citations

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