C. Lagahe-Blanchard

III-V/Si photonics by die-to-wafer bonding

Günther Roelkens, Joris Van Campenhout, Joost Brouckaert et al. · Materials Today · 2007 · 208 citations · Full text

Photonic Device, Photonics, Optical Materials +14

Germanium-On-Insulator (GeOI) structure realized by the Smart Cut™ technology

F. Letertre, C. Deguet, C. Richtarch et al. · MRS Proceedings · 2004 · 39 citations

Electrical Engineering, Engineering, Topological Insulator +5

Mechanism of Edge Bonding Void Formation in Hydrophilic Direct Wafer Bonding

Arnaud Castex, M. Broekaart, F. Rieutord et al. · ECS Solid State Letters · 2013 · 24 citations · Full text

Materials Science, Materials Engineering, Wafer Scale Processing +10

Investigation of a Sequential Three-Dimensional Process for Back-Illuminated CMOS Image Sensors With Miniaturized Pixels

P. Coudrain, Pierre Magnan, P. Batude et al. · IEEE Transactions on Electron Devices · 2009 · 15 citations

Sequential Three-dimensional Process, Engineering, Sequential Construction +17

Wafer stacking: key technology for 3D integration

C. Lagahe-Blanchard, B. Aspar · 2009 · 13 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +18