Nina Tutunjyan

Small Pitch, High Aspect Ratio Via-Last TSV Module

Stefaan Van Huylenbroeck, Michele Stucchi, Yunlong Li et al. · 2016 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber

Bivragh Majeed, Ben Jones, Deniz Sabuncuoglu Tezcan et al. · Japanese Journal of Applied Physics · 2012 · 25 citations

Engineering, Bioengineering, Genetics +16

RIE dynamics for extreme wafer thinning applications

Nouredine Rassoul, Anne Jourdain, Nina Tutunjyan et al. · Microelectronic Engineering · 2018 · 17 citations

Engineering, Manufacturing Engineering, Materials Science +13

A Highly Reliable 1.4μm Pitch Via-Last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems

Stefaan Van Huylenbroeck, Joeri De Vos, Zaid El-Mekki et al. · 2019 · 15 citations

Engineering, Electrical Engineering, Materials Science +17

"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects

Joeri De Vos, Stefaan Van Huylenbroeck, Anne Jourdain et al. · 2018 · 14 citations

Engineering, Electrical Engineering, Materials Science +17