Rajesh Katkar

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 39 citations

Engineering, Manufacturing Engineering, Microfabrication +16

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations

Engineering, Manufacturing Engineering, Materials Science +17

Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect

Jeremy Theil, Laura Mirkarimi, G. G. Fountain et al. · 2019 · 38 citations

Engineering, Computer Engineering, Electrical Engineering +17

Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2018 · 30 citations

Engineering, Materials Engineering, Materials Science +17

Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration

Guilian Gao, Jeremy Theil, G. G. Fountain et al. · 2020 · 19 citations

Engineering, Computer Engineering, Electronic Materials +15