Jeremy Theil

Local bonding environments of Si–OH groups in SiO2 deposited by remote plasma-enhanced chemical vapor deposition and incorporated by postdeposition exposure to water vapor

Jeremy Theil, D. V. Tsu, M. W. Watkins et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1990 · 178 citations

Optical Materials, Engineering, Water Vapor +16

Fluorinated amorphous carbon films for low permittivity interlevel dielectrics

Jeremy Theil · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1999 · 72 citations

Engineering, Thin Film Process Technology, Chemical Deposition +16

Carbon content of silicon oxide films deposited by room temperature plasma enhanced chemical vapor deposition of hexamethyldisiloxane and oxygen

Jeremy Theil, John G. Brace, R.W. Knoll · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1994 · 66 citations

Engineering, Cm−1 Band, Thin Film Process Technology +17

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 62 citations

Engineering, High Throughput, Integrated Circuits +16

Effects of microstructure and nonstoichiometry on electrical properties of vanadium dioxide films

Eiji Kusano, Jeremy Theil · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1989 · 59 citations

Thin Film Physics, Engineering, Vanadium Dioxide Films +18