Jong‐Min Yook

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Joohee Kim, Jonghyun Cho, Joungho Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 71 citations

Engineering, Electrical Engineering, Microelectronics +16

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Kiyeong Kim, Jong‐Min Yook, Junchul Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 44 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Compact mm-Wave Bandpass Filters Using Silicon Integrated Passive Device Technology

Dong‐Min Kim, Byung‐Wook Min, Jong‐Min Yook · IEEE Microwave and Wireless Components Letters · 2019 · 41 citations

Engineering, Electrical Engineering, Microelectronics +16

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

D. Jung, Heegon Kim, Sukjin Kim et al. · IEEE Microwave and Wireless Components Letters · 2014 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +16

Silicon-core Coaxial Through Silicon Via for Low-loss RF Si-interposer

Won-Chul Lee, Byung‐Wook Min, Jun Chul Kim et al. · IEEE Microwave and Wireless Components Letters · 2017 · 31 citations

Engineering, Electrical Engineering, Microelectronics +16