E. Liniger

Phase Compatibilities in the System Y ₂ O ₃ ‐BaO‐CuO at 950°C

K.G. Frase, E. Liniger, David R. Clarke · Journal of the American Ceramic Society · 1987 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +17

Impact of Cu microstructure on electromigration reliability

Chao Hu, L. Gignac, B. G. Baker et al. · 2007 · 63 citations

Engineering, Electrical Engineering, Materials Science +17

Chip-Package-Interaction Modeling of Ultra Low-k/Copper Back End of Line

X. H. Liu, T. M. Shaw, Michael Lane et al. · 2007 · 55 citations

Engineering, Materials Engineering, Materials Science +17

Experimental study of nanoscale Co damascene BEOL interconnect structures

James J. Kelly, Jinai Chen, Huai Huang et al. · 2016 · 52 citations

Engineering, Electrical Engineering, Materials Science +13

Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

C.-C. Yang, T. Spooner, S. Ponoth et al. · 2006 · 39 citations

Natural Sciences, Electrical Engineering, Materials Science +17