A 14 nm Embedded STT-MRAM CMOS Technology

D. Edelstein, Michael Rizzolo, Devika Sil, +38

Non-volatile MemoryEngineeringEmerging Memory TechnologyComputer ArchitectureMagnetism +14

Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

C.-C. Yang, T. Spooner, S. Ponoth, +11

Thin Film CharacterizationEngineeringInterconnect (Integrated Circuits)Reliability EngineeringRu Bilayer +17

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly, +28

Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering +11

Selective Chemical Vapor Deposition-Grown Ru for Cu Interconnect Capping Applications

C.-C. Yang, F. R. McFeely, Pinhe Wang, +2

Electrochemical and Solid-State Letters

Materials ScienceMaterials EngineeringChemical EngineeringRu Deposition SelectivityEngineering +12

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger, +24

Chip-to-package InteractionNm TechnologyElectrical EngineeringOrganic PackagesEngineering +13

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

D. Edelstein, H. Rathore, C. Davis, +60

EngineeringChip-package Reliability StressInterconnect (Integrated Circuits)Comprehensive Reliability EvaluationCu/pecvd Low-k Beol +18

Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics

F. Chen, J. Gill, D. Harmon, +8

Advanced Interconnect StructuresEngineeringDesign GroundrulesThermal ConductivityThermal Insulation +14

Characterization of Copper Electromigration Dependence on Selective Chemical Vapor Deposited Cobalt Capping Layer Thickness

C.-C. Yang, F.H. Baumann, Pinhe Wang, +4

IEEE Electron Device Letters

EngineeringChemical DepositionCo DepositionChemical EngineeringCorrosion +15

Method for the Determination of Dialkyl Phosphates in Urine by Strong Anion Exchange Disk Extraction and In-Vial Derivatization

Wang Lin, C. H. Kuei, Haonan Wu, +2

Journal of Analytical Toxicology

Residue (Chemistry)EngineeringChemical ContaminantIn-vial DerivatizationEnvironmental Chemistry +19

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

D. Edelstein, C. Davis, L. A. Clevenger, +59

EngineeringVlsi DesignChip-package ReliabilityComprehensive CharacterizationInterconnect (Integrated Circuits) +14