C.-C. Yang

A 14 nm Embedded STT-MRAM CMOS Technology

D. Edelstein, Michael Rizzolo, Devika Sil et al. · 2020 · 58 citations

Engineering, Computer Engineering, Electrical Engineering +16

Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

C.-C. Yang, T. Spooner, S. Ponoth et al. · 2006 · 39 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly et al. · 2017 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +10

Selective Chemical Vapor Deposition-Grown Ru for Cu Interconnect Capping Applications

C.-C. Yang, F. R. McFeely, Pinhe Wang et al. · Electrochemical and Solid-State Letters · 2010 · 27 citations

Engineering, Materials Engineering, Materials Science +17

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations

Engineering, Electrical Engineering, Materials Science +15