J. Dechamp - Concepedia

Author

J. Dechamp

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Also Known As

Dechamp, J., J. Dechamp, JEROME DECHAMP, Jerome Dechamp, Jerôme Dechamp, Jérome Dechamp, Jérôme Dechamp

Publications

646

Citations

H-Index

Concepts

All Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives CEA Grenoble Laboratoire d'Électronique des Technologies de l'Information Université Grenoble Alpes Institut polytechnique de Grenoble

About

J. Dechamp is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, applied physics, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	17	453
2	Applied Physics	12	16	440
3	Electrical Engineering	11	14	393
4	Natural Sciences	1	1	10
5	Computer Engineering	1	1	13

J. Dechamp

Publications

562

Citations

H-Index

Page 1

	Year	Citations
Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut <sup>TM</sup> technology A. Tauzin, T. Akatsu, Marc Rabarot, Electronics Letters	2005	67
Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium C. Deguet, L. Sanchez, T. Akatsu, Electronics Letters EngineeringSilicon On InsulatorRf SemiconductorMm Germanium-on-insulatorElectronic Packaging	2006	65
Single-mode high frequency LiNbO<sub>3</sub>Film Bulk Acoustic Resonator Marie Bousquet, Grégory Enyedi, J. Dechamp, Acoustic MethodsElectrical EngineeringEngineeringPhysicsHigh-frequency Device	2019	46
Full characterization of Cu/Cu direct bonding for 3D integration R. Taïbi, L. Di Cioccio, Cédrick Chappaz, EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Full CharacterizationHigh Density 3D	2010	45
Germanium-On-Insulator (GeOI) structure realized by the Smart Cut™ technology F. Letertre, C. Deguet, C. Richtarch, MRS Proceedings Electrical EngineeringEngineeringTopological InsulatorApplied PhysicsTopological Material	2004	39
Copper direct bonding: An innovative 3D interconnect Pierric Gueguen, L. Di Cioccio, P. Morfouli, EngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)Kelvin Structures	2010	34
Silicon-On-Diamond layer integration by wafer bonding technology Marc Rabarot, J. Widiez, S. Saada, Diamond and Related Materials Diamond-like CarbonElectrical EngineeringWafer Scale ProcessingEngineeringWafer Bonding Technology	2010	29
Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration R. Taïbi, L. Di Cioccio, C. Chappaz, EngineeringDaisy ChainsMetallic Bonding InterfacesInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2011	29
Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking Ionut Radu, Didier Landru, G. Gaudin, EngineeringBonding QualityMechanical EngineeringInterconnect (Integrated Circuits)Wafer Scale Processing	2010	29
High piezoelectric properties in LiNbO<inf>3</inf> transferred layer by the Smart Cut&#x2122; technology for ultra wide band BAW filter applications J.S. Moulet, M. Pijolat, J. Dechamp, Materials ScienceElectrical EngineeringEngineeringPhysicsPhysical Acoustic	2008	23

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