Nael Mizanur Rahman

Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse

Jinwoo Kim, Gauthaman Murali, Heechun Park et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2020 · 90 citations

Hardware Modeling, Engineering, Computer Architecture +16

Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 35 citations

Engineering, Vlsi Design, Energy Efficiency +20

Stetho-phone: Low-cost digital stethoscope for remote personalized healthcare

Shaikh Anowarul Fattah, Nael Mizanur Rahman, Ahmed Maksud et al. · 2017 · 25 citations

Smart Digital Stethoscope, Engineering, Wearable Sensor +19

First-principles calculation of the optoelectronic properties of doped methylammonium lead halide perovskites: A DFT-based study

Nael Mizanur Rahman, Mohammad Adnaan, Dimitri Adhikary et al. · Computational Materials Science · 2018 · 24 citations

Materials Science, Dft-based Study, Engineering +10

Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman et al. · 2020 · 23 citations

Interposer Substrate, Engineering, Vlsi Design +23