Anthony Primavera

Statistics

Publications

Citations

377

H-Index

Active since

1992

Affiliations

Universal Instruments (United States)(Current)

Binghamton University

Amkor Technology (United States)

Anthony Primavera is an author at Universal Instruments (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMicrostructureMaterial ScienceMaterials EngineeringElectrical EngineeringReliability EngineeringApplied PhysicsSurface Science

Publications per year

1992–2003

Publications

Effect of voids on the reliability of BGA/CSP solder joints

Mohammad Yunus, K. Srihari, James M. Pitarresi et al. · Microelectronics Reliability · 2003 · 153 citations

Electrical Engineering, Reliability Engineering, Engineering +7

Solder metallization interdiffusion in microelectronic interconnects

A. Zribi, Richard R. Chromik, R. Presthus et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 60 citations

Engineering, Mechanical Engineering, Solder Metallization Interdiffusion +17

Shear testing and failure mode analysis for evaluation of BGA ball attachment

Robert Erich, Richard Coyle, G.M. Wenger et al. · 2003 · 56 citations

Engineering, Shear Testing, Mechanical Engineering +22

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

James M. Pitarresi, Anthony Primavera · Journal of Electronic Packaging · 1992 · 56 citations

Engineering, Printed Circuit Cards, Mechanical Engineering +20

Effect of voids on the reliability of BGA/CSP solder joints

M. A. Yunus, Anthony Primavera, K. Srihari et al. · 2002 · 39 citations

Reliability, Electrical Engineering, Reliability Engineering +15

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